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Summary: Provide module package total solution; include but not limited to Stack up discussion .module design, layout, development, timeline tracking and handle the module relevant qualification. RESPONSIBILITIES: 1. PCB or substrate layout for Module projects. 2. Need work with PCB vendor, assembly house, SMT site, material vendor, to develop and qualify the new materials and new package processes. 3. Coordinate with the internal team to identify the module package related issues, giving DFM report/ suggestions for new module packages, address the root cause and find the solution. 4. Sum up the experience of module package design, SMT process and maintain the design rule. 5. Review the packaging drawings and assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc.; 6. Tracking new module PKG timeline and response to internal team. 7. Perform other tasks assigned by superiors. REQUIREMENTS: 1. Hands-on experience on PCB design in SMT or PCB factory. 2. Proficient Cadence software. AutoCAD. Having AD or PCB Designer Standard, CAM350 software experience will be better. 3. Good knowledge of SMT and PCB process, design rules 4. Bachelor’s degree with 5 years related experience.