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Summary:

Provide power module package/assembly total solution; include but not limited to module design review, assembly process development, TRA and handle the module relevant qualification.

提供電源模塊封裝/制造整體解決方案；包括但不限于模塊設(shè)計(jì)審查、封裝工藝開發(fā)、技術(shù)風(fēng)險(xiǎn)評(píng)估以及和電源模制造塊相關(guān)事務(wù)的資格認(rèn)證，等等.

RESPONSIBILITIES:

1.Power module package/assembly design rule and roadmap development;

電源模塊封裝/組件設(shè)計(jì)規(guī)則和路線圖開發(fā);

2.Review the packaging drawings and assure them to meet the design rules, include package outline, EQ list, build kit, PCB/SUB drawing, etc;

審核封裝圖紙，確保其符合設(shè)計(jì)規(guī)則，封裝尺寸、設(shè)備清單、工治具、PCB/SUB 圖紙等；

3.DFM/TRA review of power module designs with related subcons;

負(fù)責(zé)對(duì)相關(guān)的供應(yīng)商對(duì)于電源模塊設(shè)計(jì)的DFM/TRA進(jìn)行審查；

4.Work with design team, assembly house, SMT site, material vendor to develop and qualify new materials and new assembly processes;

與設(shè)計(jì)團(tuán)隊(duì)、封裝廠、SMT 現(xiàn)場(chǎng)、材料供應(yīng)商合作，開發(fā)和導(dǎo)入新材料和新的封裝工藝;

5.Coordinate with internal team to identify the module package related issues, addresses the root cause and find the solution;

通過(guò)協(xié)調(diào)內(nèi)部資源分析電源模塊相關(guān)問(wèn)題，解決根本原因并找到解決方案;

6.Sum up the experience of module package design, SMT process and maintain the design rule;

總結(jié)模塊封裝設(shè)計(jì)、SMT 工藝和維護(hù)設(shè)計(jì)規(guī)則的經(jīng)驗(yàn);

7.Perform other assigned tasks as needed;

領(lǐng)導(dǎo)安排的其他工作;

REQUIREMENTS:

1.Hands on experience on PCB/SUB design in SMT or PCB factory;

具有在 SMT 或 PCB 工廠進(jìn)行 PCB/SUB 設(shè)計(jì)的實(shí)際經(jīng)驗(yàn);

2.Familiar with AutoCAD, or PCB Designer Standard, CAM350 or Cadence software;

熟悉 AutoCAD 或 PCB Designer Standard、CAM350 或 Cadence 軟件;

3.Good knowledge of SMT,Underfill,Mold,laser marking，Singulation, backgrinding,and PCB process;

熟悉 SMT、點(diǎn)部填充、封裝、鐳射、分板 背磨和 PCB制程工藝;

4.Bachelor degree with 5 years direct related experience.

本科學(xué)歷，5 年以上直接相關(guān)工作經(jīng)驗(yàn)。