Summary:
To support new product lots, yield, and new projects development at foundry 幫助晶圓代工廠進行新產(chǎn)品技術(shù)開發(fā)和良率的提升。
RESPONSIBILITIES:
1. Responsibilities for new product and engineering lots:新產(chǎn)品開發(fā)和工程試驗方面的職責
A. MPS new tape-out support.協(xié)助代工廠進行MPS 新產(chǎn)品發(fā)布與投片
B. Ensure the correct process setting of engineering lots and the on-time delivery of engineering lots.確保工程批次以正確的工藝流程流片,同時確保工程批次能及時出貨
C. New product release and ramping up at foundry.協(xié)助晶圓代工進行新產(chǎn)品量產(chǎn)評估和產(chǎn)能擴充
D. Review the PCM and test data on all prototype and engineering lots.檢查和評估所有工程批次和試驗批次的PCM和測試數(shù)據(jù)
2. Responsibilities on production process and yield量產(chǎn)工藝流程和良率管控方面的職責
A. Review in-line critical parameter and PCM trend chart regularly to ensure stable process control to meet MPS quality requirements.檢查和評估重要工藝流程參數(shù)和PCM參數(shù)兩者的趨勢圖以確保流程控制穩(wěn)定,以達到MPS質(zhì)量要求
B. Constantly monitor the process and capacity situation at fab.持續(xù)監(jiān)控晶圓代工廠工藝流程管控和產(chǎn)能方面的情況
C. Support volume ram-up, qualification, yield 幫代工廠進行量產(chǎn)產(chǎn)能擴充,提高質(zhì)量和良率
D. Monitor the products yield trend. 監(jiān)管產(chǎn)品良率趨勢
E. Coordinate with MPS team (FE,PE,FA,TD,RET etc) and fab team to fix low yield issues .與代工廠和MPS團隊如FE,PE,FA,TD,RET等協(xié)作來解決低良率的問題
3. New projects development 新項目開發(fā)
A. Work with MPS TD or packaging team to develop new technologies at fab.與MPS TD或封裝團隊一起協(xié)作,在晶圓代工廠開發(fā)新技術(shù)
B. Coordinate with fab PIE to set process correctly. Monitor the progress of the key process modules setting. 與晶圓代工廠PIE協(xié)作設(shè)置正確流程,監(jiān)管關(guān)鍵流程模塊設(shè)置的進程
C. Project milestones review with both MPS team and fab team. Push fab to achieve the goals of projects. 與MPS和代工廠團隊共同檢查項目的重要節(jié)點。推進代工廠來達成項目的指標
4. Coordinate on process goal, fixing and process release.協(xié)同相關(guān)部門來完成工藝流程方面的目標設(shè)定,優(yōu)化并最終達到量產(chǎn)化的要求
5. Complete other tasks assigned by superior. 完成上級交辦的其他任務(wù)
REQUIREMENTS:
1. 3 years’ experience on discrete process/product maintenance, familiar with device physics about SGT and Super-junction. 3年以上分立器件工藝/產(chǎn)品維護經(jīng)驗,熟悉SGT和超級結(jié)的器件物理
2. Bachelor degree or above, majoring in Electronics or related, Fab process and customer handling experience is a plus. 本科及以上學(xué)歷,電子相關(guān)專業(yè),有Fab流程及客戶處理經(jīng)驗更佳
3. Good interpersonal skills, team work spirit, aggressive when necessary, self-motivated, goal-orientated; 良好的溝通及團隊協(xié)作,必要時應(yīng)敢于承擔,獨立自主,目標導(dǎo)向
4. Good command of fab quality system knowledge; 對fab質(zhì)量系統(tǒng)有深入了解
5. Good at English writing, speaking and reading. 英語聽說讀寫良好



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電子技術(shù)·半導(dǎo)體·集成電路
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1000人以上
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